ODB++ to 3D

This page describes the features and functions needed to from:

Gerber/Drill/IPC-D-356

ODB++

IPC 2581

into a variety of 3D (and 2.5D) formats including:

IDF 3.0

3DI

ASCII

STEP

What is Not Included

Because are targets do not really understand electrical connections we are not going to process the net information from ODB++, IPC2581 or IPC-D-356. This means that we are loosening the restrictions on the layer entities that can be next to each other.

Conductor Layers

Some 3D applications need detailed conductor layer geometries and we will provide these as we have always done - first by unionizing the conductor geometry and then exporting clean boundaries that can be extruded by the conductor thickness.

In some cases one might want to model the conductor layer merely as a solid plane with holes in it for mounting. This should be an option.

Dielectric Layers

There is no input data for dielectric layers - they are assumed to be placed between each conductor layer. The extents of the dielectric layer is defined by the board outline which should be present in the ODB and IPC2581 Step Profile under consideration. For Gerber/Drill/IPC input we should be able to designate a Gerber file that will act as an outline layer for the substrate.

Holes in the Dielectric?

If you are attempting to make a very accurate model of a PCB you would probably want a "hole" in the dielectric body where the via passes through it. However if one does this the size of the 3D file can get very large since you will also have solid bodies for the plated through drill vias.

Non Plated Through Holes

Non-plated through holes (generally used for mounting) should always appear in the substrate (and metal) since these are used to check that the 3D model of the board fits into the mechanical housing.

Mounting Holes?

Are there other ways that holes are represented in the PCB that would not be reflected as drills? We have seen cases where mounting holes are plated through -- if we filter out all plated through holes we will miss these in the output. We probably need a "diameter" filter for plated through holes ...

Components

Assuming that an ODB++/2581 file contains component information (it is not mandatory to do so) the translator reads the component's outline and extrudes it by the height attribute (assuming that the attribute is present and defined.) This produces a relatively crude cube-like approximation of the component and can be useful for determining clearance.

Notes on components ...

Drills

Drills are divided into two types: a) those that represent plated through holes used to connect one conductor layer to another; b) those that represent non-plated through holes which generally act as mounting holes for the board. A PTH drill must create a "hole" in the dielectrics and a metal cylinder in the hole. A NPT drill generates just a hole all the way through the board (but never through the components)

Notes on drill ...

Routes

In this context a route is not an electrical connection from point A to point B but rather the path of a rotating bit that is used to cut out parts of a board either for singulation or for clearance. A route may go all the way through the board or only partially through.

Notes on routes ...

Solder Mask

The solder mask is a protective polymer film that coats the top and bottom side of the PCB. The solder mask is "opened" wherever it is needed to make a connection to the PCB by soldering. We assume that the top solder mask starts at the surface of the top metal and that the bottom solder mask starts at the surface of the bottom conductor layer.

Paste Max

A paste mask is normally used for creating a screen to apply solder paste to the board. It is generally not modeled on the PCB but can be treated as if it were a solder mask.