FA4ST is Artwork's second generation package design software. After designing FA3ST together with Amkor Technology in 1997 we began a more ambitious version of the software that would address very high end and complex packages - those with large die (using staggered die pads) that required multiple rows of fingers and rings in order to bond out 500 or more die pads.

FA4ST is intended to give the advanced designer flexibility in determining ring and finger geometries.

HPBGA package synthesized by FA4ST

Features

• Create a dummy die parametrically.

• Support for staggered die pads.

• Scan GDSII file to get the die pad coordinates.

• generate multiple rings with various geometries and chamfers/fillets.

• generate multiple rows of staggered bond fingers.

• Support for tape packages where the fingers lie between ball rows.

• User customizable netlist output.

• Interfaces to Encore and Cadence APD via AIF.

• Flipchip Support.

• COB Chip-on-Board Support.